JPH029464U - - Google Patents
Info
- Publication number
- JPH029464U JPH029464U JP8698988U JP8698988U JPH029464U JP H029464 U JPH029464 U JP H029464U JP 8698988 U JP8698988 U JP 8698988U JP 8698988 U JP8698988 U JP 8698988U JP H029464 U JPH029464 U JP H029464U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- base film
- coverlay
- insulating flexible
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims 4
- 230000002265 prevention Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8698988U JPH029464U (en]) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8698988U JPH029464U (en]) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH029464U true JPH029464U (en]) | 1990-01-22 |
Family
ID=31311626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8698988U Pending JPH029464U (en]) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH029464U (en]) |
-
1988
- 1988-06-30 JP JP8698988U patent/JPH029464U/ja active Pending